Noctua NT-H1 3.5g

Noctua NT-H1 3.5g

Features

Noctua NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines.

Thanks to its excellent performance, exceptional ease of use, and outstanding long-term stability, it has become an established favorite among overclockers and enthusiast users worldwide.

Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking, or silent systems: NT-H1 is a proven premium paste that’s guaranteed to deliver great results.

Award-winning performance

Bundled with Noctua’s premium-grade CPU coolers since 2007, Noctua NT-H1 has proven its excellent performance in countless tests and reviews. Chosen again and again by overclockers and hardware enthusiasts around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).

Easy to apply

Thanks to its excellent spreading properties, there is no need to manually spread Noctua NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put it on the heatsink and you’re ready to go!

Easy to clean

Noctua NT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent is required!

Not electrically conductive, non-corroding

While some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with Noctua NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminum and whether it’s nickel-plated or not.

Excellent long-term stability

NT-H1’s unique formula is highly stable over time, even after long periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out, and thermal cycling characteristics, it can be used on the CPU for 5 years or more

No break-in or burn-in required

Some thermal compounds need a longer break-in period or cure time until they reach their full performance and some thermal pads must undergo a dedicated burn-in process. By contrast, NT-H1 is ready to go right away and doesn’t require any special preparations.

3.5g package for 3-20 applications

Sufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then.