Aorus DD5 32GB (2x16GB) 5200MHz Memory
AORUS Memory DDR5 5200MHz 32GB Memory Kit, XMP 3.0, Selected High-Quality Memory ICs, INTEL Z690 certified.
- Memory Size:32GB Kit (2 x 16GB)
- Frequency: DDR5-5200 MHz
- Timing : 40-40-40-80 (XMP 5200MHz)
- Performance Profile: XMP 3.0
- Copper-aluminum composite heat spreaders with nanocarbon coating to keep performance
- Intel Z690 certificated
- Lifetime warranty
- Comply with industrial standard JEDEC DDR5
Thrilling Performance and Quality Guaranteed
AORUS DDR5 memory delivers reliably fast DDR5-5200 memory speed, also bringing the new experience of the latest XMP 3.0. Moreover, by utilizing a copper-aluminum composite with a NanoCarbon heat spreader, there is no compromise when overclocking. Offering higher performance, better bandwidth, and lower power consumption than DDR4 modules. AORUS DDR5 memory is a new evolution for all PC enthusiasts and extreme gamers.
Optimized Working Voltage, Better Energy Saving
AORUS DDR5 memory delivers ultra-fast speed. However, when running at a similar frequency, AORUS DDR5 memory operates with lower power consumption as compared to DDR4.
HIGHER STABILITY & GREATER EFFICIENCY
All the 10-Layer PCBs are conducted by strict quality control to make sure stable performance.
DDR5 memory module features a new function, on-die ECC which allows to self-correct DRAM cells. On-die ECC brings reliability and makes your PC more stable than before.
Power Management integrated circuit (PMIC)
The latest DDR5 modules are with built-in Power Management integrated circuit (PMIC). It unlocks DDR5 voltage control, improving the overclocking performance and capability.
COPPER-ALUMINUM COMPOSITE WITH NANOCARBON HEAT SPREADER
AORUS DDR5 memory adopts a new copper-aluminum composite material heat spreader. Combine the advantages of copper’s heat conduction and aluminum’s heat dissipation, and make sure no compromise when overclocking. Besides, NanoCarbon coating enhances the passive thermal spreader when under ultra-high performance. The coating material covers the entire heat spreader. In that way, heat is dissipated more quickly. High voltage may cause a memory leak over 70°C and failure. However, the Copper-aluminum composite with NanoCarbon heat spreader, a dedicated design for DDR5, greatly helps to avoid any potential problem when overclocking; moreover, keeps the temperature under 70°C.
SUPPORTS NEW XMP 3.0, DEFINE YOUR OWN XMP PROFILE
AORUS DDR5 memory module supports the latest XMP 3.0 specification and improves overclocking capabilities and profiles. Not only apply the pre-tune XMP profile, now, but users can also define and fine-tune their own XMP profiles, and save profiles into SPD ROM. Enjoy benefits from XPM 3.0 by the AORUS DDR5 memory module.
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